登录 注册 会员服务 联系我们

Spreading process and interfacial characteristic of Sn–17Bi–0.5Cu/Ni at temperatures ranging from 523 K to 673 K

  • Published:2012-11 Issue: Volume:414 Page:57-65
  • ISSN:0927-7757
  • Container-title:Colloids and Surfaces A: Physicochemical and Engineering Aspects
  • language:en
  • Short-container-title:Colloids and Surfaces A: Physicochemical and Engineering Aspects

Author:

Zang Likun,Yuan Zhangfu,Zhu Yuanqing,Xu Bingsheng,Matsuura Hiroyuki,Tsukihashi Fumitaka

Funder

University of Science and Technology Beijing

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Colloid and Surface Chemistry

Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Deformation mechanism of various Sn-xBi alloys under tensile tests;Advanced Composites and Hybrid Materials;2021-03-11

2. Marangoni-Convection-Driven Bubble Behavior and Microstructural Evolution of Sn-3.5Ag/Sn-17Bi-0.5Cu (Wt Pct) Alloy Solidified on Cu Substrate Under Space Microgravity Condition;Metallurgical and Materials Transactions A;2019-08-22

3. Wetting Behavior and Interfacial Characteristics of High Temperature Melts Under Microgravity;Physical Science Under Microgravity: Experiments on Board the SJ-10 Recoverable Satellite;2019

4. Microstructure and mechanical behavior of Sn–40Bi–xCu alloy;Journal of Materials Science: Materials in Electronics;2017-07-17

5. XPS Depth Study on the Liquid Oxidation of Sn-Bi-Zn-X(Al/P) Alloy and the Effect of Al/P on the Film;Advances in Materials Science and Engineering;2015
同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3