XPS Depth Study on the Liquid Oxidation of Sn-Bi-Zn-X(Al/P) Alloy and the Effect of Al/P on the Film
Author:
Affiliation:
1. School of Material and Science Engineering, Jiangsu University of Science and Technology, Zhenjiang 212003, China
2. School of Mechanical and Electrical Engineering, Shanghai Dianji University, Shanghai 201306, China
Abstract
Funder
National Natural Science Foundation of China
Publisher
Hindawi Limited
Subject
General Engineering,General Materials Science
Link
http://downloads.hindawi.com/journals/amse/2015/257231.pdf
Reference21 articles.
1. Thermal Interface Materials in Electronic Packaging
2. Spreading process and interfacial characteristic of Sn–17Bi–0.5Cu/Ni at temperatures ranging from 523 K to 673 K
3. Interfacial characteristics of molten Bi-43Sn alloy on amorphous and crystalline Fe78B13Si9
4. Bi Layer Formation at the Anode Interface in Cu/Sn-58Bi/Cu Solder Joints with High Current Density
5. Effects of Zn, Zn-Al and Zn-P Additions on the Tensile Properties of Sn-Bi Solder
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