Curing kinetic, thermal and adhesive properties of epoxy resin cured with cashew nut shell liquid-Reference-Cited by-同舟云学术

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Curing kinetic, thermal and adhesive properties of epoxy resin cured with cashew nut shell liquid

Published:2015-01 Issue: Volume:600 Page:20-27
ISSN:0040-6031
Container-title:Thermochimica Acta
language:en
Short-container-title:Thermochimica Acta

Author:

Kasemsiri Pornnpa,Neramittagapong Arthit,Chindaprasirt Prinya

Funder

Khon Kaen University Fund

Thailand Research Fund

Publisher

Elsevier BV

Subject

Physical and Theoretical Chemistry,Condensed Matter Physics,Instrumentation

Reference41 articles.

1. Cure kinetics of epoxy resins studied by non-isothermal DSC data;Rosu;Thermochim. Acta,2002

2. Curing behavior, thermal, and mechanical properties of epoxy resins cured with a novel liquid crystalline dicarboxylic acid curing agent;Sinh;Polym. Eng. Sci.,2014

3. Curing behaviors and kinetics of epoxy resins with a series of biphenyl curing agents having different methylene units;Wang;Thermochim. Acta,2011

4. Toughening of a trifunctional epoxy system part VI. Structure property relationships of the thermoplastic toughened system;Varley;Polymer,2001

5. Cure kinetics and thermal stability of micro and nanostructured thermosetting blends of epoxy resin and epoxidized styrene-block-butadiene-block-styrene triblock copolymer systems;George;Polym. Eng. Sci.,2012

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