Cure kinetics and thermal stability of micro and nanostructured thermosetting blends of epoxy resin and epoxidized styrene-block-butadiene-block-styrene triblock copolymer systems-Reference-Cited by-同舟云学术

Cure kinetics and thermal stability of micro and nanostructured thermosetting blends of epoxy resin and epoxidized styrene-block-butadiene-block-styrene triblock copolymer systems

Published:2012-04-24 Issue:11 Volume:52 Page:2336-2347
ISSN:0032-3888
Container-title:Polymer Engineering & Science
language:en
Short-container-title:Polym Eng Sci

Author:

George Sajeev Martin,Puglia Debora,Kenny Josè M.,Jyotishkumar P.,Thomas Sabu

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,General Chemistry,Materials Chemistry,Polymers and Plastics,General Chemistry

Reference41 articles.

1. The curing reaction of poly(ether-sulfone)-modified epoxy resin

2. Cure kinetics and morphology of amine-cured tetraglycidyl-4,4′-diaminodiphenylmethane epoxy blends with poly(ether imide)

3. Toughening of a trifunctional epoxy system

4. Intractable high-Tg thermoplastics processed with epoxy resin: Interfacial adhesion and mechanical properties of the cured blends

5. Thermal properties of amine cured diglycidyl ether of bisphenol A epoxy blended with poly(ether imide)

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