An analytical thermal resistance model for calculating mean die temperature of a typical BGA packaging
Author:
Publisher
Elsevier BV
Subject
Physical and Theoretical Chemistry,Condensed Matter Physics,Instrumentation
Reference19 articles.
1. Proc. 11th IEEE Proc. SEMI-THERM Conf.;Lasance,1995
2. S-parameter-measurement-based high-speed signal transient characterization of VLSI interconnects on SiO/sub 2/-Si substrate
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