Analytical thermal resistance model for calculating mean die temperature of eccentric quad flat no-leads packaging on printed circuit board-Reference-Cited by-同舟云学术

Analytical thermal resistance model for calculating mean die temperature of eccentric quad flat no-leads packaging on printed circuit board

Published:2021-03-01 Issue:3 Volume:11 Page:035039
ISSN:2158-3226
Container-title:AIP Advances
language:en
Short-container-title:AIP Advances

Author:

Wang Yongchao¹²³^ORCID,Wei Xin¹^ORCID,Zhang Guohao³,Hu Zhengfa²,Zhao Zhongwei¹,Wang Lei⁴

Affiliation:

1. School of Electromechanical Engineering, Guangdong University of Technology, Guangzhou 510006, China

2. Synergy Innovation Institute for Modern Industries of Dongyuan and GDUT, Heyuan 517500, China

3. Synergy Innovation Institute of Heyuan and GDUT, Heyuan 517025, China

4. Institute of New Materials, Guangdong Academy of Sciences, National Engineering Laboratory for Modern Materials Surface Engineering Technology, The Key Lab of Guangdong for Modern Surface Engineering Technology, Guangzhou 510006, China

Funder

National Natural Science Foundation of China

Science and Technology Planning Project of Guangdong Province

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Link

https://aip.scitation.org/doi/pdf/10.1063/5.0043051

Reference25 articles.

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4. Hybrid integration of scalable mechanical and magnetophoretic focusing for magnetic flow cytometry

5. A. Bar-Cohen, T. Elperin, and R. Eliasi, in Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium (IEEE, Diego, CA, 1989), p. 724.

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