MULTI-CHIP COUPLING THERMAL RESISTANCE TOPOLOGICAL NETWORK MODEL AND CHIP JUNCTION TEMPERATURE PREDICTION OF SYSTEM IN PACKAGE
Author:
Publisher
Begell House
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Link
https://www.dl.begellhouse.com/download/article/30d577e01ee6eae8/HTR-44334.pdf
Reference34 articles.
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2. Anderson, K.R., Teaching Capstone Thermal Systems Design Using ANSYS ICEPAK Based Projects, ASME2019Int. Mechanical Engineering Congress and Exposition, Salt Lake City, UT, 2020.
3. Appello, D., Bernardi, P., Grosso, M., and Reorda, M.S., System-in-Package Testing: Problems and Solutions, IEEE Design Test Comput., vol. 23, no. 3, pp. 203-211, 2006. DOI: 10.1109/MDT.2006.79
4. Ben Abdelmlek, K., Araoud, Z., Charrada, K., and Zissis, G., Optimization of the Thermal Distribution of Multi-Chip LED Package, Appl. Therm. Eng., vol. 126, pp. 653-660, 2017. DOI: 10.1016/j.applthermaleng.2017.07.136
5. Chen, C., Hou, F., Liu, F., She, Q., Cao, L., and Wan, L., Thermo-Mechanical Reliability Analysis of a RF SiP Module Based on LTCC Substrate, Microelect. Reliab, vol. 79, pp. 38-47, 2017. DOI: 10.1016/j.microrel.2017.10.003
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