1. Encapsulation of flip chip structures;Machuga,1992
2. Resin-insertion effect on thermal cycle resistivity of flip–chip mounted LSI devices;Nakano,1987
3. Mechanical behavior and reliability of solder joint interconnections in thermally matched assemblies;Suhir,1992
4. Flip–chip solder bump fatigue life enhanced by polymer encapsulation;Suryanarayana,1990
5. Mechanical behavior of flip–chip encapsulant;Suhir;J. Electron. Packag.,1990