Using pulsed and modulated photothermal radiometry to measure the thermal conductivity of thin films
Author:
Publisher
Elsevier BV
Subject
Physical and Theoretical Chemistry,Condensed Matter Physics,Instrumentation
Reference18 articles.
1. Thermal characterization of the SiO2–Ge2Sb2Te5 interface from room temperature up to 400°C;Battaglia;J. Appl. Phys.,2010
2. Microsystems elements based on free-standing thick films made with a new sacrificial layer process;Lucat;Microelectron. Reliab.,2008
3. Thermal conductivity measurement from 30 to 750K: the 3 omega method;Cahill;Rev. Sci. Instrum.,1990
4. Thermal diffusivity measurement of thin films by means of an ac calorimetric method;Hatta;Rev. Sci. Instrum.,1985
5. Detection of thermal waves through optical reflectance;Rosencwaig;Appl. Phys. Lett.,1985
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