1. Effect of NH/sub 3/-plasma treatment and CMP modification on TDDB improvement in Cu metallization
2. Reduced electromigration of Cu wires by surface coating
3. A. Preusse, R. Seidel, O. Aubel, M. Nopper, B. Freudenberg, M. Schaller, M. Fecher, T. Letz, C. Bartsch, A. Ott, M. Friedemann, F. Feustel, M.A. Meyer, P. Limbecker, in: Inter-national Interconnect Technology Conference, 2008.
4. S. Chhun, L.G. Gosset, W.F.A. Besling, T. Vanypre, Ph. Brun, E. Oilier, M. Mellier, G. Imbert, S. Jullian, A. Margain, J. Guillan, R. Gras, J.-C. Dupuy, J. Torres, in: International Reliability Physics Symposium, 2004.
5. T. Takewaki, H. Yamada, T. Shibata, T. Ohmi, T. Nitta, in: Proc. of Int. Symp. on Power Semicon. Devices and ICs, 1995, p. 438.