Reliability evaluation of ultra thin 3D-IC package under the coupling load effects of the manufacturing process and temperature cycling test-Reference-Cited by-同舟云学术

Reliability evaluation of ultra thin 3D-IC package under the coupling load effects of the manufacturing process and temperature cycling test

Published:2021-05 Issue: Volume:244-246 Page:111572
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Lee Chang-Chun,Lin Yu-Min,Liu Hou-Chun,Syu Ji-Yuan,Huang Yuan-Cheng,Chang Tao-Chih

Funder

Taiwan Ministry of Science and Technology

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference34 articles.

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5. Effect of wafer level underfill on the microbump reliability of ultrathin-chip stacking type 3D-IC assembly during thermal cycling tests;Lee;Materials,2017

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