Cracking energy estimation of ultra low-k package using novel prediction approach combined with global–local modeling technique-Reference-Cited by-同舟云学术

Cracking energy estimation of ultra low-k package using novel prediction approach combined with global–local modeling technique

Published:2008-10 Issue:10 Volume:85 Page:2079-2084
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Lee Chang-Chun,Chou Tsung-Lin,Chiu Chien-Chia,Hsia Chin-Chiu,Chiang Kuo-Ning

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference16 articles.

1. Adhesion and reliability of copper interconnects with Ta and TaN barrier layers

2. T. C. Huang, C. T. Peng, C. H. Yao, C. H. Huang, S. Y. Li, Y. C. Wang, W. K. Wan, K. C. Lin, C. C. Hsia, M. S. Liang, Evaluation and numerical simulation of optimal structural designs for reliable packaging of ultra low k process technology, in: Proceedings of IEEE Int. Interconnect Technol. Conf., 2006, pp. 92–94.

3. Packaging effects on reliability of cu/low-k interconnects

4. Chip-packaging interaction: a critical concern for Cu/low k packaging

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