Finite element analysis on the factors affecting die crack propagation in BGA under thermo-mechanical loading-Reference-Cited by-同舟云学术

Finite element analysis on the factors affecting die crack propagation in BGA under thermo-mechanical loading

Published:2020-10 Issue: Volume:116 Page:104717
ISSN:1350-6307
Container-title:Engineering Failure Analysis
language:en
Short-container-title:Engineering Failure Analysis

Author:

Lim Niño Rigo Emil G.,Ubando Aristotle T.,Gonzaga Jeremias A.,Dimagiba Richard Raymond N.

Funder

Science Education Institute, Department of Science and Technology, Republic of the Philippines

Philippine Council for Industry, Energy, and Emerging Technology Research and Development

Publisher

Elsevier BV

Subject

General Engineering,General Materials Science

Reference63 articles.

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3. W. Feng, N. Watanabe, H. Shimamoto, M. Aoyagi, K. Kikuchi, “Validation of TSV thermo-mechanical simulation by stress measurement”. Microlectronics Reliability, (2016). [Online]. Available: https://doi.org/10.1016/j.microrel.2016.01.007 [Accessed Jan. 20, 2018].

4. B. Vandevelde, et al., “Chip-package interaction in 3D stacked IC packages using Finite Element Modelling”. Microlectronics Reliability, (2014). [Online]. Available: https://doi.org/10.1016/ j.microrel.2014.02.026 [Accessed Jan. 20, 2018].

5. G.E. Moore, “Cramming more components onto integrated circuits”, Electronics Magazine, (1965), volume 38, number 8, (April 19, 1965), pp.114-117.

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