Fractures of low-k materials in a RF package with integrated passive device based on TGV

Author:

Wu Luchao,Wang Lei,Wang Jun

Funder

Ministry of Education - Singapore

National Natural Science Foundation of China

Publisher

Elsevier BV

Reference29 articles.

1. IPD dual-band filter chip with a large frequency ratio for 5G microwave and millimeter-wave applications;Yang;AEU-Int. J. Electron. C.,2023

2. A W-band 1-dB insertion loss Wilkinson power divider using silicon-based integrated passive device;Hsiao;IEEE Microw Wirel Co,2021

3. 5 GHz band n79 wideband microacoustic filter using thin lithium niobate membrane;Turner;Electron. Lett.,2019

4. Historical perspective of system in package (SiP);Dai;IEEE Circ. Syst. Mag.,2016

5. Design and demonstration of ultra-thin glass 3D IPD diplexers;Wu,2016

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