Evaluation and Numerical Simulation of Optimal Structural Designs for Reliable Packaging of Ultra Low K Process Technology-Reference-Cited by-同舟云学术

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Evaluation and Numerical Simulation of Optimal Structural Designs for Reliable Packaging of Ultra Low K Process Technology

Published:2006 Issue: Volume: Page:
ISSN:
Container-title:2006 International Interconnect Technology Conference
language:
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Author:

Huang T.C.,Peng C.T.,Yao C.H.,Huang C.H.,Li S.Y.,Liang M.S.,Wang Y.C.,Wan W.K.,Lin K.C.,Hsia C.C.,Mong-Song Liang

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/10964/34566/01648655.pdf?arnumber=1648655

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Process Technology for Copper Interconnects;Handbook of Thin Film Deposition;2018

2. Process Technology for Copper Interconnects;Handbook of Thin Film Deposition;2012

3. Fine and ultra‐fine pitch wire bonding: challenges and solutions;Microelectronics International;2009-05-08

4. Cracking energy estimation of ultra low-k package using novel prediction approach combined with global–local modeling technique;Microelectronic Engineering;2008-10

5. Wire bonding of low‐kdevices;Microelectronics International;2008-07-25

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