Grain structure and crystallographic orientation in Cu damascene lines-Reference-Cited by-同舟云学术

Grain structure and crystallographic orientation in Cu damascene lines

Published:2004-02 Issue:2 Volume:71 Page:182-189
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Ji Yuan,Zhong Taoxing,Li Zhiguo,Wang Xiaodong,Luo Dong,Xia Yang,Liu Zhimin

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference17 articles.

1. P.R. Besser, A. Marathe, L. Zhao, M. Herrick, C. Capasso, H. Kawasaki, Optimizing the electromigration performance of copper lines, in: Technical Digest International Electron Devices Meeting, 2000, pp. 119–121

2. Effect of texture and grain structure on electromigration in Al-0.5%Cu thin films

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