Effect of different electrolytes on the microstructure, corrosion and whisker growth of pulse plated tin coatings-Reference-Cited by-同舟云学术

Effect of different electrolytes on the microstructure, corrosion and whisker growth of pulse plated tin coatings

Published:2017-02 Issue: Volume:170 Page:59-68
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Sharma Ashutosh^ORCID,Das Siddhartha,Das Karabi

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference39 articles.

1. Tin-lead (SnPb) solder reaction in flip chip technology;Tu;Mater. Sci. Eng. R,2001

2. Development of Alternatives to Lead Bearing Solders;Vianco,1993

3. Sn-whiskers: truths and myths;Osenbach;J. Mater. Sci. Mater. Electron.,2007

4. Handbook of Solder Technology for Microelectronic Assemblies;Puttiltz,2004

5. Tin Whiskers: A History of Documented Electrical System Failures, a Briefing Prepared for the Space Shuttle Program Office;Leidecker,2006

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