Integrated diffusion–recombination model for describing the logarithmic time dependence of plasma damage in porous low-k materials-Reference-Cited by-同舟云学术

Integrated diffusion–recombination model for describing the logarithmic time dependence of plasma damage in porous low-k materials

Published:2011-05 Issue:5 Volume:88 Page:631-634
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Kunnen E.,Barkema G.T.,Maes C.,Shamiryan D.,Urbanowicz A.,Struyf H.,Baklanov M.R.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference7 articles.

1. E. Kunnen, A. Urbanowicz, D. Shamiryan, H. Bender, A. Franquet, H. Struyf, W. Boullart, M.R. Baklanov, in: 56th American Vacuum Society Conference, November 8–13, 2009, San Jose, California, p. 78 (Abstract Book PS-TuA7).

2. E. Hudson, M. Moravej, M. Block, S. Sirard, D. Wei, K. Takeshita, in: AVS 2009, San Jose California, 56th American Vacuum Society Conference, November 8–13, 2009, San Jose, California, p. 190 (Abstract Book PS2-ThM11).

3. Effect of energetic ions on plasma damage of porous SiCOH low-k materials

4. Oxygen radical and plasma damage of low-k organosilicate glass materials: Diffusion-controlled mechanism for carbon depletion

5. J. Kelber, S. Behera, S. Manandhar, S. Gaddam, in: San Jose California, 56th American Vacuum Society Conference, November 8–13, 2009, San Jose California, p. 9 (Abstract Book PS1-MoM3).

Cited by 14 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Cross-linking processes in antimicrobial UV-sol-gel systems initiated by atmospheric pressure plasma;Thin Solid Films;2022-12

2. Surface preparation of porous Si-graphene nanocomposites for heteroepitaxy;Journal of Vacuum Science & Technology B;2020-09

3. Porous Low-Dielectric-Constant Material for Semiconductor Microelectronics;Nanofluid Flow in Porous Media;2020-08-19

4. Review of methods for the mitigation of plasma‐induced damage to low‐dielectric‐constant interlayer dielectrics used for semiconductor logic device interconnects;Plasma Processes and Polymers;2019-06-27

5. Plasma Damage on Low-k Dielectric Materials;Plasma Science and Technology - Basic Fundamentals and Modern Applications;2019-02-27