Author:
Song Haizheng,Norman John A.T.,Shimogaki Yukihiro
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference23 articles.
1. International Technology Roadmap for Semiconductors, 2007 Update .
2. L. Hofmann, M. Kuechler, T. Gumprecht, R. Ecke, S.E. Schulz, T. Gessner, in: Proceedings of the Advanced Metallization Conference, 2007, p. 623.
3. Copper Metallization for High Performance Silicon Technology
4. CVD process for copper interconnection
5. The Role of Gas‐Phase Reactions during Chemical Vapor Deposition of Copper from (hfac)Cu(tmvs)
Cited by
7 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献