Influence of current density on mechanical reliability of Sn–3.5Ag BGA solder joint-Reference-Cited by-同舟云学术

Influence of current density on mechanical reliability of Sn–3.5Ag BGA solder joint

Published:2011-05 Issue:5 Volume:88 Page:709-714
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Ha Sang-Su,Sung Ji-Yoon,Yoon Jeong-Won,Jung Seung-Boo

Funder

Ministry of Science and Technology, Taiwan

Korea Science and Engineering Foundation

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference14 articles.

1. A cohesive zone model for low cycle fatigue life prediction of solder joints

2. Intermetallic morphology around Ni particles in Sn‐3.5Ag solder

3. Physics and materials challenges for lead-free solders

4. Low-cost Flip Chip Technology;Lau,2000

5. Electromigration of eutectic SnPb solder interconnects for flip chip technology

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