Copper electroplating technique for efficient manufacturing of low-cost silicon interposers

Author:

Zhang YazhouORCID,Wang Huiying,Sun Yunna,Wu Kaifeng,Wang Hong,Cheng Ping,Ding Guifu

Funder

National Basic Research Priorities Program of China

Chinese National Science and Technology Major Project

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference16 articles.

1. Trends in R&D in TSV technology for 3D LSI packaging;Yoshinaga;Sci. Technol. Trends,2010

2. An overview of through-silicon-via technology and manufacturing challenges;Gambino;Microelectron. Eng.,2015

3. Overview and outlook of through-silicon via (TSV) and 3D integrations;Lau;Microelectron. Int.,2011

4. Linear sweep voltammetric study on the copper electrodeposition of though-silicon-vias;Cao;J. Electrochem. Soc.,2014

5. Through silicon via copper electrodeposition for 3D integration;Beica,2008

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