A study on exploring the alkaline copper CMP slurry without inhibitors to achieve high planarization efficiency-Reference-Cited by-同舟云学术

A study on exploring the alkaline copper CMP slurry without inhibitors to achieve high planarization efficiency

Published:2016-07 Issue: Volume:160 Page:5-11
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Luan Xiaodong,Liu Yuling,Wang Chenwei,Niu Xinhuan,Wang Juan,Zhang Wenqian

Funder

major national science and technology special projects

Department of Education-Funded Research Projects of Hebei Province, China

Natural Science Young Foundation of Hebei Province, China

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference40 articles.

1. Chemical processes in the chemical mechanical polishing of copper;Steigerwald;Mater. Chem. Phys.,1995

2. Cu–CMP for dual damascene technology: prestonian vs. non-prestonian regimes of Cu removal;Gotkis;J. Electron. Mater.,2001

3. Impact of electroplated copper thickness on copper CMP and Cu/Coral™ BEOL integration;Seah;Microelectron. Eng.,2005

4. Copper CMP evaluation: planarization issues;Fayolle;Microelectron. Eng.,1997

5. Effect of chelating agent concentration in alkaline Cu CMP process under the condition of different applied pressures;Yuan;J. Semicond.,2014

Cited by 29 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Friction Properties and Mechanism of Aluminum Sheets Under an Eco-Friendly CMCS Lubrication Condition;Tribology Letters;2024-01-27

2. Surface Interaction Effect and Mechanism of Methionine Derivatives as Novel Inhibitors for Alkaline Copper CMP: Insights from Molecular Simulation and Experimental Analysis;ECS Journal of Solid State Science and Technology;2023-08-31

3. Effect of DL-alanine as an auxiliary complexing agent in TSV copper film CMP;Journal of Materials Research;2023-05-24

4. Surface Corrosion Inhibition Effect and Action Mechanism Analysis of 5-Methyl-Benzotriazole on Cobalt-Based Copper Film Chemical Mechanical Polishing for GLSI;ECS Journal of Solid State Science and Technology;2023-04-01

5. A review: research progress of chemical–mechanical polishing slurry for copper interconnection of integrated circuits;The International Journal of Advanced Manufacturing Technology;2023-01-03