Impact of electroplated copper thickness on copper CMP and Cu/Coral™ BEOL integration-Reference-Cited by-同舟云学术

Impact of electroplated copper thickness on copper CMP and Cu/Coral™ BEOL integration

Published:2005-07 Issue:1 Volume:81 Page:66-74
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Seah C.H.,You G.Z.,Wang S.R.,Li C.Y.,Kumar R.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference13 articles.

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3. D. Edelstein, et al., in: Proceeding of IEEE International Electron Devices Meeting, 1997, p. 773

4. Chemical mechanical polishing of copper for multilevel metallization

5. H.C. Chen, M.S. Yang, J.Y. Wu, W. Lur, in: Proceeding of IEEE International Interconnect Technology Conference, 1999, p. 65

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