A microfabrication process for a vacuum-encapsulated microchamber-Reference-Cited by-同舟云学术

A microfabrication process for a vacuum-encapsulated microchamber

Published:2005-04 Issue:3-4 Volume:77 Page:412-419
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Randolph Steven J.,Hale Mark D.,Guillorn Michael A.,Rack Philip D.,Simpson Michael L.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference15 articles.

1. Investigation of field emission characteristics for Si-base materials: Titanium silicide, poly-Si, and single crystal Si

2. A novel in situ vacuum encapsulated lateral field emitter triode

3. Sealed-cavity resonant microbeam accelerometer

4. Polysilicon vibrating gyroscope vacuum-encapsulated in an on-chip micro chamber

5. Polycrystalline silicon thin films with hydrofluoric acid permeability for underlying oxide etching and vacuum encapsulation

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Eco-micropunching Techniques for Bioenergy Application;Clean Energy Production Technologies;2021

2. Green/Eco-friendly Micropunching Techniques for Energy Application;Handbook of Nanomaterials and Nanocomposites for Energy and Environmental Applications;2021

3. An infrared energy harvesting device using planar cross bowtie nanoantenna arrays and diode-less rectification based on electron field emission;Journal of Modern Optics;2020-09-19

4. Green/Eco-friendly Micropunching Techniques for Energy Application;Handbook of Nanomaterials and Nanocomposites for Energy and Environmental Applications;2020

5. Vacuum microdevices;Bulletin of the Polish Academy of Sciences: Technical Sciences;2012-01-01