Author:
Stangl M.,Lipták M.,Fletcher A.,Acker J.,Thomas J.,Wendrock H.,Oswald S.,Wetzig K.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference34 articles.
1. Multilevel interconnections for ULSI and GSI era
2. T. Nogami, A. Preusse, V. Dubin, Apparatus for Forming a Copper Interconnect, Patent No. US 6106680 A, 2000.
3. Metal Based Thin Films for Electronics;Wetzig;Wiley-VCH,2006
4. Kupferschichten – Abscheidung, Eigenschaften, Anwendung;Kanani,2000
5. Thermodynamics and kinetics of room-temperature microstructural evolution in copper films
Cited by
74 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献