Influence of crystallite size and impurity density on the grain structure evolution of electroplated copper films during thermal and laser annealing-Reference-Cited by-同舟云学术

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Influence of crystallite size and impurity density on the grain structure evolution of electroplated copper films during thermal and laser annealing

Published:2024-09 Issue: Volume:805 Page:140514
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Han Silin^ORCID,Li Chongyang,Chen Yuhang^ORCID,Wu Yunwen,Li Ming,Hang Tao^ORCID

Funder

Shanghai Jiao Tong University

National Natural Science Foundation of China

Publisher

Elsevier BV

Reference27 articles.

1. Current status and advances in damascene electrodeposition;Akolkar,2018

2. Technology and reliability constrained future copper interconnects. I. Resistance modeling;Kapur;IEEE Trans. Electron Devices,2002

3. High-performance interconnects: an integration overview;Havemann;Proc. IEEE,2001

4. ITRS: the international technology roadmap for semiconductors;Hoefflinger,2012

5. Interconnect processing: integration, dielectrics, metals;Chen,2023

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