Simulation and measurement of the capacitance benefit of air gap interconnects for advanced technology nodes-Reference-Cited by-同舟云学术

Simulation and measurement of the capacitance benefit of air gap interconnects for advanced technology nodes

Published:2014-05 Issue: Volume:120 Page:90-94
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Kumaresan V.,Wilson C.J.,Verdonck P.,Van Besien E.,Lazzarino F.,Truffert V.,Bömmels J.,Tokei Zs.,Wong T.K.S.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference18 articles.

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4. Advanced Cu interconnects using air gaps

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