1. Advanced Cu interconnects using air gaps
2. Process and Reliability of Air-Gap Cu Interconnect Using 90-nm Node Technology
3. A multilevel copper/low-k/airgap BEOL technology;nitta;Advanced Metallization Conference,2008
4. Extremely Low Keff.(1.9) Cu Interconnects with Air Gap Formed Using SiOC;ueda;IITC,2007