Correlation of electromigration defects in small damascene Cu interconnects with their microstructure-Reference-Cited by-同舟云学术

Correlation of electromigration defects in small damascene Cu interconnects with their microstructure

Published:2005-12 Issue:3-4 Volume:82 Page:660-664
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Wendrock Horst,Mirpuri Kabir,Menzel Siegfried,Schindler Günther,Wetzig Klaus

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference7 articles.

1. ITRS Roadmap, Semiconductor Industries Association, 2003 ed. Available from: .

2. Recent advances on electromigration in very-large-scale-integration of interconnects

3. Copper interconnections and reliability

4. Interface diffusion in eutectic Pb–Sn solder

5. A. Buerke, H. Wendrock, T.G. Koetter, S. Menzel, K. Wetzig, A.V. Glasow, in: C.A. Volkert, A.H. Verbruggen, D. Brown, (Eds.), MRS Symp. Proc., vol. 563, San Francisco, 1999, pp. 109–114.

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