Evaluation of lead-free SnAg solder ball deposition and reflow processes for flip chip applications-Reference-Cited by-同舟云学术

Evaluation of lead-free SnAg solder ball deposition and reflow processes for flip chip applications

Published:2005-12 Issue:3-4 Volume:82 Page:581-586
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Helneder Johann,Hoyler Charlotte,Schneegans Manfred,Torwesten Holger

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference3 articles.

1. Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment, Official Journal of the European Union, 13.2.2003, pp. L37/19–23.

2. J. Salmi, J. Salonen, Solder bump flip chip Workshop on Bonding and Die Attach Technologies, CERN, Geneva, Switzerland, June 11–12, 2003.

3. B. Ebersberger, R. Bauer, L. Alexa, Future Fab Intl. 17, June 6, 2004.

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