Thin Film Characterization on Cu/SnAg Solder Interface for 3D Packaging Technologies

Author:

Beers Kimberly,Hollowell Andrew E.,Bahar Basim G.

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference10 articles.

1. C. Song, Z. Wang, Q. Chen, J. Cai, L Liu, Microelectron. Eng., 85 (10), 1952–1956, (2008).

2. L. F. Miller, IBM J. of R&D, 13 (3), 239–250, (1969).

3. Y. Oriiet al, 2011 IEEE 61st ECTC, Lake Buena Vista, FL, 340-345, (2011).

4. J. Woertink, et al, 2014 IEEE 64th ECTC, Orlando, FL, 342-347, (2014).

5. Johann Helnederet al, Microelectron. Eng., 82, (3-4), 581–586, (2005).

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1. Effect of Solder Thick on the Interfacial Reaction in Cu/Sn/Ni Solder Joints;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

2. Analysis of the Possibilities of Creating Embedded Vias’ Based on Different Solder Alloys;2023 46th International Spring Seminar on Electronics Technology (ISSE);2023-05-10

3. Effect of Ag Additives on the Consumption of a Cathode Cu Pad in a Cu/Sn3.5Ag/Cu Flip-Chip Structure Under Electromigration;Journal of Electronic Materials;2021-10-11

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