Non-PR Sn-3.5Ag Bumping on a Fast Filled Cu-Plug by PPR Current-Reference-Cited by-同舟云学术

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Non-PR Sn-3.5Ag Bumping on a Fast Filled Cu-Plug by PPR Current

Published:2013-04 Issue:4 Volume:3 Page:574-580
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Hong Sung Chul,Jung Do Hyun,Lee Wang Gu,Kim Wonjoong,Jung Jae Pil

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/5503870/6490033/06449298.pdf?arnumber=6449298

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review;Materials;2023-12-14

2. A Review on the Fabrication and Reliability of Three-Dimensional Integration Technologies for Microelectronic Packaging: Through-Si-via and Solder Bumping Process;Metals;2021-10-19

3. Three-Dimesnional Semicondoctor Stacking using TSV(Through-Si-Via) Technology;Journal of Welding and Joining;2021-06-30

4. Through-Silicon via Submount for Flip-Chip LEDs;ECS Journal of Solid State Science and Technology;2017

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