Repair of plasma-damaged p-SiOCH dielectric films in supercritical CO2-Reference-Cited by-同舟云学术

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Repair of plasma-damaged p-SiOCH dielectric films in supercritical CO2

Published:2010-11 Issue:9 Volume:87 Page:1680-1684
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Jung Jae Mok,Kwon Hong Seok,Lee Won-Ki,Choi Byung-Chun,Kim Hyun Gyu,Lim Kwon Taek

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference21 articles.

1. High-performance interconnects: an integration overview

2. Interconnect limits on gigascale integration (GSI) in the 21st century

3. Plasma deposition of low-dielectric-constant fluorinated amorphous carbon

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1. Organosilicone Compounds in Supercritical Carbon Dioxide;Polymers;2022-06-11

2. Enhanced Thermo–Mechanical Reliability of Ultralow-K Dielectrics with Self-Organized Molecular Pores;Materials;2021-04-28

3. Influence of topological constraints on ion damage resistance of amorphous hydrogenated silicon carbide;Acta Materialia;2019-02

4. Rapid Recovery Process of Plasma Damaged Porous Low-k Dielectrics by Wet Surface Modifying Treatment;Solid State Phenomena;2016-09

5. Organosilicon compounds in supercritical carbon dioxide: Synthesis, polymerization, modification, and production of new materials;Polymer Science Series B;2016-05

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