Author:
Balla Tobias,Spearing S. Mark
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference23 articles.
1. Imprint of sub‐25 nm vias and trenches in polymers
2. Novel thermoplastic polymers with improved release properties for thermal NIL
3. T. Balla, S.M. Spearing, A. Monk, J. Phys. D: Appl. Phys. 41 (17) (2008) 174001 (10 pp.).
4. Improved Pattern Transfer in Nanoimprint Lithography at 30 nm Half-Pitch by Substrate−Surface Functionalization
5. Z. Song, Study of Demolding Process in Thermal Imprint Lithography via Numerical Simulation and Experimental Approaches in Mechanical Engineering, Louisiana State Univeristy, Baton Rouge, 2007.
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献