Quantification of shear induced agglomeration in chemical mechanical polishing slurries under different chemical environments-Reference-Cited by-同舟云学术

Quantification of shear induced agglomeration in chemical mechanical polishing slurries under different chemical environments

Published:2019-04 Issue: Volume:210 Page:1-7
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Khanna Aniruddh J.^ORCID,Gupta Sushant,Kumar Purushottam,Chang Feng-Chi,Singh Rajiv K.

Funder

University of Florida

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference35 articles.

1. Microlens Array fabrication by chemical mechanical polishing;Kumar;Electrochem. Solid-State Lett.,2009

2. Surface shaping using chemical mechanical polishing;Kumar;J. Electrochem. Soc.,2011

3. Analysis of light out-coupling from microlens Array;Kumar;Opt. Commun.,2011

4. R. Bajaj, D. Redfield, M. Orilall, B. Fu, A. Khanna, J. G. Fung, M. Cornejo, A. Chockalingam, M. Yamamura, V. R. R. Kakireddy, “Polishing Pads Produced by an Additive Manufacturing Process”, US Patent App. 14/885, 950, 2016.

5. R. Bajaj, D. Redfield, M. Orilall, B. Fu, A. Khanna, J. G. Fung, M. Cornejo, A. Chockalingam, M. Yamamura, V. R. Kakireddy, “Polishing Pads Produced by an Additive Manufacturing Process”, US Patent App. 14/920, 801, 2016.

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