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Microlens Array Fabrication by Chemical Mechanical Polishing

  • Published:2009 Issue:7 Volume:12 Page:H269
  • ISSN:1099-0062
  • Container-title:Electrochemical and Solid-State Letters
  • language:en
  • Short-container-title:Electrochem. Solid-State Lett.

Author:

Kumar Purushottam,Son Seung-Young,Lee Jaeseok,Chang Feng-Chi,Khanna Aniruddh,Chakkaravarthi Arjunan Arul,Singh Rajiv K.

Publisher

The Electrochemical Society

Subject

Electrical and Electronic Engineering,Electrochemistry,Physical and Theoretical Chemistry,General Materials Science,General Chemical Engineering

Cited by 10 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Theoretical and experimental investigations on conformal polishing of microstructured surfaces;International Journal of Mechanical Sciences;2024-04

2. Soft Chemical Mechanical Polishing Pad for Oxide CMP Applications;ECS Journal of Solid State Science and Technology;2021-01-01

3. Engineering Surface Texture of Pads for Improving CMP Performance of Sub-10 nm Nodes;ECS Journal of Solid State Science and Technology;2020-10-12

4. High-Performance Pad Conditioning (HPPC) Arm for Augmenting CMP Performance;ECS Journal of Solid State Science and Technology;2020-08-03

5. Investigation of the Impact of Pad Surface Texture from Different Pad Conditioners on the CMP Performance;ECS Journal of Solid State Science and Technology;2020-08-03
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