Funder
Technology Innovation Program
Ministry of Knowledge Economy
National Research Foundation of Korea
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference58 articles.
1. Size-dependent resistivity in Nanoscale interconnects;Josell;Annu. Rev. Mater. Sci.,2009
2. Technology and reliability constrained future copper interconnects. I. Resistance modeling;Kapur;IEEE Trans. Electron Dev.,2002
3. Sub-100 nm2 cobalt interconnects;Dutta;IEEE Electron Device Lett.,2018
4. Electron mean free path in elemental metals;Gall;J. Appl. Phys.,2016
5. Cobalt bottom-up contact and via prefill enabling advanced logic and DRAM technologies;Veen,2015
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