Author:
Siew Yong Kong,Stucchi Michele,Versluijs Janko,Roussel Philippe,Kunnen Eddy,Pantouvaki Marianna,Beyer Gerald P.,Tokei Zsolt
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
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4. Integration of 20nm Half Pitch Single Damascene Copper Trenches by Spacer-Defined Double Patterning (SDDP) on Metal Hard Mask;Siew,2010
Cited by
3 articles.
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