Measurement and modelling of the thermal conductivity of dispersed aluminium composites
Author:
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Chemical Engineering,Atomic and Molecular Physics, and Optics
Reference20 articles.
1. Thermal and mechanical properties of aluminum powder-filled high density polyethylene composites;Tavman;J. Appl. Polym. Sci.,1996
2. Thermal and mechanical properties of copper powder filled poly(ethylene) composites;Tavman;Powder Technol.,1997
3. Metal powder-filled polyethylene composites. V. Thermal properties;Sofian;J. Thermoplast. Compos. Mater.,2001
4. A numerical and experimental study on thermal conductivity of particle filled polymer composites;Kumlutas;J. Thermoplast. Compos. Mater.,2006
5. Metal filled high density polyethylene composites — electrical and tensile properties;Nurazreena;J. Thermoplast. Compos. Mater.,2006
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