Effect of stacking chips and inlet positions on void formation in the encapsulation of 3D stacked flip-chip package
Author:
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Chemical Engineering,Atomic and Molecular Physics, and Optics
Reference23 articles.
1. Influence of temperature, humidity and defect location on delamination in plastics packages;Tay;IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A,1999
2. Multi-stack flip chip 3D packaging with copper plated through-silicon vertical interconnection;Hon;Electronics Packaging Technology Conference,2005
3. Computational modeling and validation of the encapsulation of plastic packages by transfer molding;Nguyen;Journal of Electronic Packaging,2000
4. Numerical analysis on the effects of different inlet gates and gap heights in TQFP encapsulation process;Khor;International Journal of Heat and Mass Transfer,2011
5. On the dynamics of air-trap in the encapsulation process of microelectronic package;Chang,1998
Cited by 29 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Thermo-rheological and kinetic characterization and modeling of an epoxy vitrimer based on polyimine exchange;Soft Matter;2024
2. Electric field and viscous fluid polarity effects on capillary-driven flow dynamics between parallel plates;Heliyon;2023-06
3. Electronic packaging and thermal management;Polymers in Electronics;2023
4. Underfill Flow in Flip-Chip Encapsulation Process: A Review;Journal of Electronic Packaging;2021-08-06
5. Regional Segregation With Spatial Considerations-Based Analytical Filling Time Model for Non-Newtonian Power-Law Underfill Fluid in Flip-Chip Encapsulation;Journal of Electronic Packaging;2019-10-18
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3