Printed electronics for extreme high temperature environments-Reference-Cited by-同舟云学术

Printed electronics for extreme high temperature environments

Published:2022-06 Issue: Volume:54 Page:102709
ISSN:2214-8604
Container-title:Additive Manufacturing
language:en
Short-container-title:Additive Manufacturing

Author:

Alhendi Mohammed,Alshatnawi Firas,Abbara El Mehdi,Sivasubramony Rajesh,Khinda Gurvinder,Umar Ashraf I.,Borgesen Peter,Poliks Mark D.,Shaddock David,Hoel Cathleen,Stoffel Nancy,Lam Tommyhing-K.H.

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Engineering (miscellaneous),General Materials Science,Biomedical Engineering

Reference59 articles.

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4. G.W. Hunter, R.S. Okojie, P.G. Neudeck, G.M. Beheim, G.E. Ponchak, G. Fralick, J. Wrbanek, L.Y. Chen, High temperature electronics, communications, and supporting technologies for venus missions, n.d.

5. Reliability assessment of high temperature electronics and packaging technologies for venus mission;Chen;IEEE Int. Reliab. Phys. Symp. Proc.,2008

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