Assessment and improvement of adhesion of printed silver-based inks on alumina produced by fused filament fabrication-Reference-Cited by-同舟云学术

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Assessment and improvement of adhesion of printed silver-based inks on alumina produced by fused filament fabrication

Published:2024-08 Issue: Volume:8 Page:100067
ISSN:2772-3704
Container-title:Power Electronic Devices and Components
language:en
Short-container-title:Power Electronic Devices and Components

Author:

Utsch Daniel^ORCID,Sippel Marcel,Voigt Christian,Häußler Felix,Franke Jörg

Funder

Bundesministerium fur Bildung und Forschung Dienststelle Berlin

Forschungszentrum Jülich GmbH Projektträger Jülich

Bundesministerium für Bildung und Forschung

Publisher

Elsevier BV

Reference45 articles.

1. Printed electronics for extreme high temperature environments;Alhendi;Additive Manufacturing,2022

2. Ankenbrand, M. et al., “Generation of RF Structures on Additively Manufactured Substrates by Printed Electronics and Laser Structuring,” in Kauai, 2023. [Online]. Available: https://smta.org/page/knowledge-search#conference-proceedings/proceedings-by-year/5e46de4c222bfe08592ecfd5/view-publication-details5/64517354b4950300283478bd/entry-details4/645174ed0e46690d6145b460/.

3. Printed Electronics as Prepared by Inkjet Printing;Beedasy;Materials (Basel, Switzerland),2020

4. Pretreatment and Structuring of Spatial Circuit Carriers Based on Alumina for High Temperatures and High Frequencies;Braeuer,2022

5. Investigation of adhesion strength of metallization on thermoplastic and ceramic substrates;Brinkhues,2016

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