Funder
Agency for Science Technology and Research
Subject
Materials Chemistry,Mechanics of Materials,General Materials Science
Reference28 articles.
1. Through silicon via technologies for interconnects in RF MEMS;Zhu;Microsyst. Technol.,2005
2. Comprehensive study of the resistivity of copper wires with lateral dimensions of 100nm and smaller;Steinhogl;J. Appl. Phys.,2005
3. High frequency characterization and modelling of high density TSV in 3D integrated circuits;Bermond,2009
4. Analysis of CNT based 3D TSV for emerging RF applications;Gupta,2011
5. http://www.reportbuyer.com/computing_electronics/electrical_components/3dic_tsv_interconnects_2012_business_update.html.
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