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Sputtering resistance and damage mechanism of Y2O3-based ceramics etching by Xe plasma

  • Published:2021-03 Issue: Volume:26 Page:101775
  • ISSN:2352-4928
  • Container-title:Materials Today Communications
  • language:en
  • Short-container-title:Materials Today Communications

Author:

Tan Yicheng,Wang Yong,Wu Shanghua,Chen Peng,Zhu Zuoxiang,Tian Zhuo

Funder

Guangdong Science and Technology Department

Publisher

Elsevier BV

Subject

Materials Chemistry,Mechanics of Materials,General Materials Science

Reference16 articles.

1. Plasma etching: yesterday, today, and tomorrow;Donnelly;J. Vac. Sci. Technol. A,2013

2. Fluorocarbon based atomic layer etching of Si3N4 and etching selectivity of SiO2 over Si3N4;Li;J. Vac. Sci. Technol. A,2016

3. A comparative study of CF4/O2/Ar and C4F8/O2/Ar plasmas for dry etching applications;Chun;Thin Solid Films,2015

4. M. Nakahara, Y. Itoh. Ceramic member resistant to halogen-plasma corrosion, US6383964, 2002.

5. Effect of the microstructures of yttria ceramics on their plasma corrosion behavior;Hiroaki;Ceram. Int.,2019

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