First-principles investigation of Cu/Ti-TM/Si (TM=W, Ru) interfaces: Role of Ti-TM binary alloys as diffusion barrier layers
Author:
Funder
Yunnan Key Research and Development Program
Basic Research Programs of Sichuan Province
Publisher
Elsevier BV
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3. S. Datta, R. Pandey, A. Agrawal, S.K. Gupta, R. Arghavani, Impact of contact and local interconnect scaling on logic performance, in: 2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers, 2014, pp. 1-2.
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