Atomic layer deposited self-forming Ru-Mn diffusion barrier for seedless Cu interconnects
Author:
Funder
MEST
KBSI
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference27 articles.
1. Alteration of Cu conductivity in the size effect regime
2. Size-dependent resistivity of metallic wires in the mesoscopic range
3. Growth behavior of self-formed barrier at Cu–Mn∕SiO2 interface at 250–450°C
4. Self-forming diffusion barrier layer in Cu–Mn alloy metallization
5. Electroplating Copper onto Resistive Barrier Films
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