First-principles calculations to investigate the structural stability, electronic and mechanical properties of CuGa2 and Cu9Ga4

Author:

Guo Shihao,Huang Yaoxuan,Wang Li,Gao Zhaoqing,Wang Yunpeng,Ma Haitao

Publisher

Elsevier BV

Reference47 articles.

1. Interfacial reactions between Ga and Cu-10Ni substrate at low temperature;Liu;ACS Appl. Mater. Interfaces,2020

2. Formation of solid-solution Cu-to-Cu joints using Ga solder and Pt under bump metallurgy for three-dimensional integrated circuits;Lin;Electron. Mater. Lett.,2015

3. Interfacial Reactions in the Cu/Ga/Co and Cu/Ga/Ni Samples;Chen;J. Electron. Mater.,2019

4. Analysis of intermetallic compound formation in the reactions at liquid Ga/solid Pd interface;Kim;Surf. Interfaces,2022

5. Effects of Ga addition on microstructure and properties of Sn–Ag–Cu/Cu solder joints;Zhang;J. Alloy. Compd.,2015

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