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Improving tensile strength of SnAgCu/Cu solder joint through multi-elements alloying

  • Published:2021-12 Issue: Volume:29 Page:102768
  • ISSN:2352-4928
  • Container-title:Materials Today Communications
  • language:en
  • Short-container-title:Materials Today Communications

Author:

Zhu Tangkui,Zhang Qingke,Bai Hailong,Zhao Lingyan,Yan Jikang

Funder

China Postdoctoral Science Foundation

National Key Research and Development Program of China

Major Science and Technology Projects in Yunnan Province

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Materials Chemistry,Mechanics of Materials,General Materials Science

Reference28 articles.

1. A review of lead-free solders for electronics applications;Cheng;Microelectron Reliab.,2017

2. Effect of kaolin geopolymer ceramic addition on the properties of Sn-3.0Ag-0.5Cu solder joint;Mohamad Zaimi;Mater. Today Commun.,2020

3. Impurity and alloying effects on interfacial reaction layers in Pb-free soldering;Laurila;Mater. Sci. Eng. R,2010

4. Effect of alloying elements on properties and microstructures of SnAgCu solders;Gao;Microelectron Eng.,2010

5. Property alterations of Sn-0.6Cu-0.05Ni-Ge lead-free solder by Ag, Bi, In and Sb addition;Kanlayasiri;Trans. Nonferrous Metals Soc. China,2018

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