Author:
Hokka Jussi,Li Jue,Mattila Toni T.,Paulasto-Kröckel Mervi
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference22 articles.
1. Advances in the drop-impact reliability of solder joints for mobile applications;Wong;Microelectron Reliab,2009
2. A review of board level solder joints for mobile applications;Wong;Microelectron Reliab,2008
3. JEDEC Standard JESD22-B111. Board level drop test method of components for handheld electronic products; July 2003.
4. Marjamäki P, Mattila TT, Kivilahti JK. A comparative study of the failure mechanisms encountered in drop and large amplitude vibration tests. Proc ECTC 2006: 95–101.
5. Mattila TT, Suotula L, Kivilahti JK. Replacement of the drop test with the vibration test – the effect of test temperature on reliability. Proc ECTC 2008: 629–37.
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献