Advances in the drop-impact reliability of solder joints for mobile applications-Reference-Cited by-同舟云学术

Advances in the drop-impact reliability of solder joints for mobile applications

Published:2009-02 Issue:2 Volume:49 Page:139-149
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Wong E.H.,Seah S.K.W.,van Driel W.D.,Caers J.F.J.M.,Owens N.,Lai Y.-S.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference29 articles.

1. European Standard ESTI EN300019-2-7, Environmental engineering, environmental conditions and environmental test for telecommunication equipments; Part 2–7: specifications of environmental tests, portable and non-stationary use.

2. IEC 68-2-32 Method 1, Drop test.

3. JEDEC Standard JESD22-B111, Board level drop test method of components for handheld electronic products.

4. Wong EH, Lim KM, Lee N, Seah S, Koh C, Wang J. Drop impact test – mechanics and physics of failure. In: Proceedings of the 4th electronic packaging technology conference; 2002. p. 327–33.

5. A review of solder joints for mobile applications;Wong;Microelectron Reliab,2008

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